Which of the following fabrication techniques is ideally suited for digital ICs?

The correct answer is option 1):(Monolithic)

Concept:

Monolithic fabrication:

• The monolithic fabrication consists of various processes such as wafer preparation, circuit probing, base and emitter diffusions, pre-ohmic etch, metallization, epitaxial growth, diffused isolation, wire bonding, encapsulation, dicing, mounting and packaging, and final testing
• It is used  for production of digital ICs
• In monolithic IC ,all circuit components ,both active and passive elements and their interconnections are manufactured into or on top of a single chip of silicon

Hybrid  fabrication:

• Hybrid  fabrication  refers to processes that take uses of both 3D printing operations  and more commonplace mill/turn cutting operations
• Hybrid fabrication used for making turbine bladesand etc.

Thin flim fabrication:

• Thin metal film deposition is a unique fabrication process commonly used in the manufacturing of semiconductors, biosensors, and other specialized photolithography applications.
• The process involves carefully depositing thin metallic film coating onto a substrate in order to yield specific material properties. For example, specially engineered thin film coatings are used in the fields of optics and imaging to modify the optical properties of glass.